MEMS Technology low contact force and High CCC Probe
Assemble up to 30K probe head
Direct docking solutions (V93K, Uflex, T2000)
Mems Probe | Probing for Cu-Pillar Bumps | Probing for AL Pads | |||
---|---|---|---|---|---|
Min Pitch (Full Array) | ≥110 µm | ≥90 µm | ≥50 um | ≥90 µm | ≥50 µm |
Probe name | VW150H | VW90 | VW50 | VW90P | VW50P |
Tip Size (µm) | 70 x 40 | 55 x 55 | 25 x 25 | 55 x 55 Pointed Tip : 5~8 µm |
25 x 25 Pointed tip : 5~8 µm |
Force @3mils OT | 3.5±0.7g | 2±0.4g | 1.5±0.3g | 3±0.6g | 2±0.4g |
CCC (ISMI 2009) | ≥1.5A | ≥1.5A | ≥450 mA | ≥1.1A | ≥450 mA |