SoC Probe Card
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High Electrical performance VPC Vertical Probe Card Online Inquiry
Key benefits
MEMS 기술 낮은 접촉력 및 높은 CCC 프로브
최대 30K 프로브 헤드 조립
직접 도킹 솔루션(V93K, Uflex, T2000)
| Mems Probe | Probing for Cu-Pillar Bumps | Probing for AL Pads | |||
|---|---|---|---|---|---|
| Min Pitch (Full Array) | ≥110 µm | ≥90 µm | ≥50 um | ≥90 µm | ≥50 µm |
| Probe name | VW150H | VW90 | VW50 | VW90P | VW50P |
| Tip Size (µm) | 70 x 40 | 55 x 55 | 25 x 25 | 55 x 55 Pointed Tip : 5~8 µm |
25 x 25 Pointed tip : 5~8 µm |
| Force @3mils OT | 3.5±0.7g | 2±0.4g | 1.5±0.3g | 3±0.6g | 2±0.4g |
| CCC (ISMI 2009) | ≥1.5A | ≥1.5A | ≥450 mA | ≥1.1A | ≥450 mA |
company news
- Directions
- Headquarters (2nd Plant) 3rd plant MEMS Fab
티에스이 / 주소 : 충남 천안시 서북구 직산읍 군수 1길 189 (군서리 213-15) / TEL. 041-581-9955
(C) TSE Co., Ltd.
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